Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Global Market is Projected to Reach $13.7 Billion by 2030: AI and Machine Learning Set to Accelerate Adoption of HMC and HBM
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Global Market for Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM)

Global Market for Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM)
Global Market for Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM)

Dublin, June 21, 2023 (GLOBE NEWSWIRE) -- The "Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM): Global Strategic Business Report" report has been added to ResearchAndMarkets.com's offering.

The global market for Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) estimated at US$2.4 Billion in the year 2022, is projected to reach a revised size of US$13.7 Billion by 2030, growing at a CAGR of 24.2% over the analysis period 2022-2030.

HMC, one of the segments analyzed in the report, is projected to record 23.3% CAGR and reach US$8.2 Billion by the end of the analysis period.

Taking into account the ongoing post pandemic recovery, growth in the Hbm segment is readjusted to a revised 25.7% CAGR for the next 8-year period.

The U.S. Market is Estimated at $1.1 Billion, While China is Forecast to Grow at 30.9% CAGR

The Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) market in the U.S. is estimated at US$1.1 Billion in the year 2022. China, the world's second largest economy, is forecast to reach a projected market size of US$2.9 Billion by the year 2030 trailing a CAGR of 30.9% over the analysis period 2022 to 2030.

Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 20.1% and 18% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 22.3% CAGR.

Select Competitors (Total 17 Featured) -

  • Advanced Micro Devices, Inc.

  • Arira Design

  • ARM Ltd.

  • Cadence Design Systems, Inc.

  • Cray, Inc.

  • Fujitsu Ltd.

  • IBM Corporation

  • Intel Corporation

  • Marvell Technology Group Ltd.

  • Micron Technology, Inc.

  • NVIDIA Corporation

  • Open-Silicon, Inc.

  • Rambus, Inc.

  • Samsung Electronics Co., Ltd.

  • SK Hynix, Inc.

  • Xilinx Inc.

Key Attributes:

Report Attribute

Details

No. of Pages

263

Forecast Period

2022 - 2030

Estimated Market Value (USD) in 2022

$2.4 Billion

Forecasted Market Value (USD) by 2030

$13.7 Billion

Compound Annual Growth Rate

24.3%

Regions Covered

Global

Key Topics Covered:

I. METHODOLOGY

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

  • Influencer Market Insights

  • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM): A Prelude

  • Massive Growth Projected for World HMC and HBM Market

  • HMC: Dominant Memory Type

  • Breakdown of Revenue Share (in %) for HMC and HBM for the Years 2019 and 2025

  • HBM Demonstrates Fastest Growth

  • Recently Updated HBM 2 to Steer Robust Growth in HBM Uptake

  • HBM Vs. GDDR5 and DDR3: A Snapshot of Bandwidth Comparison

  • Central Processing Unit (CPU) Represents the Largest Product Type

  • Accelerated Processing Unit (APU) Emerges as Fastest Growing Product Type

  • The United States: Single Largest Regional Market for HMC and HBM Technologies

  • Breakdown of Revenue Share (in %) for USA and Rest of World for the Years 2019 and 2025

  • China and Emerging Regions Demonstrate Fast Paced Growth

  • Global HMC and HBM Market - Geographic Regions Ranked by Value CAGR for 2018-2025: China, Asia-Pacific, Rest of World, Europe, USA, Japan, and Canada

  • Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) - Global Key Competitors Percentage Market Share in 2022 (E)

  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)

  • Impact of Covid-19 and a Looming Global Recession